Solid-state bonding of silicon chips to copper substrates with graded circular micro-trenches
نویسندگان
چکیده
منابع مشابه
Solid-state bonding technique for template-stripped ultraflat gold substrates.
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ژورنال
عنوان ژورنال: Journal of Materials Science: Materials in Electronics
سال: 2018
ISSN: 0957-4522,1573-482X
DOI: 10.1007/s10854-018-9047-7